Junior PCB Layout Design Engineer

HMG LINKS is a multi-sector recruitment company focused on tailor-made solutions for its partners’ human resources needs. We strongly believe in an honest and ethical approach to recruitment.

Are you a visual thinker? Do you have a solid electronics understanding? Do you enjoy thinking in three dimensions?
Our Client has an opportunity for a motivated and experienced PCB Layout Design Engineer who enjoys the challenge of designing complex printed circuit boards and is willing to become an integral part of a product development team.

The right candidate will create printed circuit board artwork working with electronics, embedded and hardware engineers, while contributing design expertise during implementation of products which combine power circuitry, micro-processors and high-speed communications.

Responsibilities:

• Design PCBs including analog, high-speed digital, and mixed signal from initial block diagram through delivery
• Perform DRC and other verification using layout tools
• Coordinate with external partners to execute fabrication and assembly
• Document BOM and full fabrication process including assembly

Minimum Qualifications:

• Altium Designer or equivalent schematic/layout tools
• Good knowledge and hands-on experience in high density, high-speed PCB for high layer count on large form factor products
• Ability to work well with a diverse group of dedicated engineers and technicians
• Good communications in oral and written English language

What is in for you?

• Designing new and innovative world class products
• A friendly and exciting atmosphere
• An open company culture where everyone’s voice can be heard
• Competitive remuneration package

Have we raised your interest? Then we look forward to getting to know you. Please send us your CV in English for immediate consideration.

Only short-listed candidates will be contacted. All applications will be treated in strict confidentiality. Recruitment license issued by Ministry of Labour and Social Policy under № 2356 / 19.09.2017.